Extension of high-density interconnect multichip module technology for MEMS packaging
- 著者名:
- Butler,J.T. ( Air Force Institute of Technology )
- Bright,V.M. ( Air Force Institute of Technology )
- Saia,R.J. ( GE Corporate Research and Development Ctr. )
- Comtois,J.H ( Air Force Research Lab. )
- 掲載資料名:
- Micromachined Devices and Components III
- シリーズ名:
- Proceedings of SPIE - the International Society for Optical Engineering
- シリーズ巻号:
- 3224
- 発行年:
- 1997
- 開始ページ:
- 169
- 終了ページ:
- 177
- 出版情報:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819426567 [0819426563]
- 言語:
- 英語
- 請求記号:
- P63600/3224
- 資料種別:
- 国際会議録
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