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Wafer bonding with an adhesive coating

著者名:
  • Klink,G. ( Fraunhofer-Institute for Solid State Technology (Germany) )
  • Hillerich,B. ( Fraunhofer-Institute for Solid State Technology (Germany) )
掲載資料名:
Micromachined Devices and Components IV
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
3514
発行年:
1998
開始ページ:
50
終了ページ:
61
出版情報:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819429735 [0819429732]
言語:
英語
請求記号:
P63600/3514
資料種別:
国際会議録

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