Stress effect on the via crack of IMD structure in scrubber processing
- 著者名:
Huang,D.F. ( Taiwan Semiconductor Manufacturing Co. ) Yeh,R.S. Lin,T.-Y. Hung,C.-C. Lin,T.C. Chang,C.H. Chen,C.H. - 掲載資料名:
- Device and process technologies for MEMS and microelectronics : 27-29 October 1999, Royal Pines Resort, Queensland, Australia
- シリーズ名:
- Proceedings of SPIE - the International Society for Optical Engineering
- シリーズ巻号:
- 3892
- 発行年:
- 1999
- 開始ページ:
- 377
- 終了ページ:
- 384
- 出版情報:
- Bellingham, Wash., USA: SPIE - The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819434937 [0819434930]
- 言語:
- 英語
- 請求記号:
- P63600/3892
- 資料種別:
- 国際会議録
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Evaluation, reduction, and monitoring of progressive defects on 193-nm reticles for low-k1 process
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