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MICROMECHANICAL TESTING OF ELECTRONIC PACKAGING COMPONENTS AND MATERIALS

著者名:
掲載資料名:
Electronic packaging materials science VII : symposium held November 29-December 3, 1993, Boston, Massachusetts, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
323
発行年:
1994
開始ページ:
385
出版情報:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558992221 [1558992227]
言語:
英語
請求記号:
M23500/323
資料種別:
国際会議録

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