Blank Cover Image

EFFECT OF MECHANICAL STRESS ON ELECTROMIGRATION FAILURE MODE DURING ACCELERATED ELECTROMIGRATION TESTS

著者名:
Pramanick, S.
Brown, D. D.
Pham, V,
Besser, P.
Sanchez, J.
Bui, N.
Hijab, R.
Yue, J. T.
さらに 3 件
掲載資料名:
Thin films, stresses and mechanical properties V : symposium held November 28-December 2, 1994, Boston, Massachusetts, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
356
発行年:
1995
開始ページ:
507
出版情報:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558992573 [155899257X]
言語:
英語
請求記号:
M23500/356
資料種別:
国際会議録

類似資料:

1 国際会議録 Electromigration Failure Distributions for Multi-Layer Interconnects as a Function of Line Width: Experiments and Simulation

Brown, D. D., Sanchez, J. E., Jr., Pham, V., Besser, P. R., Korhonen, M. A., Li, C.-Y.

MRS - Materials Research Society
7 国際会議録 Electromigration failure modes and Blech effect in single-inlaid Cu interconnects

Thrasher,S., Capasso,C., Zhao,L., Hernandez,R., Mulski,P., Rose,S., Nguyen,T., Kawasaki,H.

SPIE-The International Society for Optical Engineering
2 国際会議録 The Effect of Cluster Interactions on Electromigration Induced Stress Evolution in Confined Metal Lines

Brown, D. D., Sanchez, J. E., Jr., Besser, P. R., Korhonen, M. A., Li, C.-Y.

MRS - Materials Research Society
8 国際会議録 EFFECT OF STRESSES ON VOID NUCLEATION DURING ELECTROMIGRATION

Brotzen, F. R., Rosenmayer, C. T., Dunn, C. F., McPherson, J. W.

Materials Research Society
3 国際会議録 The Microstructure and Electromigration Performance of Damascene-Fabricated Aluminum Interconnects

Besser, Paul R., Sanchez, John E., Jr., Field, David P., Pramanick, Shekhar, Sahota, Kashmir

MRS - Materials Research Society
9 国際会議録 *ELECTROMIGRATION FAILURE AND MECHANICAL STRESS IN THIN FILM CONDUCTORS

Lloyd, J. R.

Materials Research Society
4 国際会議録 The Microstructure and Electromigration Performance of Damascene-Fabricated Aluminum Interconnects

Besser, Paul R., Sanchez, John E., Jr., Field, David P., Pramanick, Shekhar, Sahota, Kashmir

MRS - Materials Research Society
10 国際会議録 Electromigration Failure Modes in CU Metallization*

Gall, M., Capasso, C., Thrasher, S., Zhao, L., Muiski, P., Hernandez, R., Herrick, M., Angyal, M., Boeck, B., Kawasaki, …

Electrochemical Society
5 国際会議録 MECHANICAL STRESS AND ELECTROMIGRATION FAILURE

Lloyd, J. R.

Materials Research Society
11 国際会議録 Effect of the Finite Source Material on Electromigration Performance of a Novel Interconnect Test Structure

Bui, Nguyen D.

MRS - Materials Research Society
6 国際会議録 EFFECT OF Cu AND Si IN ALUMINUM ON STRESS CHANGE AND ON TiAl3 FORMATION IN Al ALLOY/Ti BILAYER FILMS DURING ANNEALING

Brown, Dirk D., Besser, Paul R., Sanchez, John E., Jr., Korhonen, Matt A., Li, Che-Yu

MRS - Materials Research Society
12 国際会議録 MICROSTRUCTURE BASED MODELLING OF STRESS MIGRATION AND ELECTROMIGRATION INDUCED FAILURE DISTRIBUTIONS

Borgesen, P., Korhonen, M. A., Brown, D. D., Li. C. -Y.

MRS - Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12