COMPARISON OF AMORPHOUS AND POLYCRYSTALLINE TUNGSTEN NITRIDE DIFFUSION BARRIER FOR MOCVD-Cu METALLIZATION

COMPARISON OF AMORPHOUS AND POLYCRYSTALLINE TUNGSTEN NITRIDE DIFFUSION BARRIER FOR MOCVD-Cu METALLIZATION

著者名:

掲載資料名:

Evolution of thin film and surface structure and morphology : symposium held November 28-December 2, 1994, Boston, Massachusetts, USA

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

355

発行年:

1995

開始ページ:

441

出版情報:

Pittsburgh, Pa.: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558992566 [1558992561]

言語:

英語

請求記号:

M23500/355

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00016576
シリーズID:	PA00000011
会議名:	Symposium on evolution of thin film and surface structure and morphology
回次:	1994
会議開催地:	Boston, MA, USA
会議開催年:	1994.11.28-1994.12.02

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