Blank Cover Image

Effects of illumination wavelength on the accuracy of optical overlay metrology

著者名:
Han,J.-S. ( Samsung Electronics Co.,Ltd. )
Kim,H.
Nam,J.-L.
Han,M.-S.
Lim,S.-K.
Yanowitz,S.D.
Smith,N.P.
Smout,A.M.C.
さらに 3 件
掲載資料名:
Optical Microlithography X
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
3051
発行年:
1997
開始ページ:
417
終了ページ:
425
出版情報:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819424655 [081942465X]
言語:
英語
請求記号:
P63600/3051
資料種別:
国際会議録

類似資料:

1 国際会議録 Improved overlay reading on MLR structures

Yeo,J.-H., Nam,J.-L., Oh,S.-H., Moon,J.-T., Koh,Y.-B., Smith,N.P., Smout,A.M.

SPIE-The International Society for Optical Engineering
7 国際会議録 In-chip overlay metrology [6152-40]

Ku, Y. S., Tung, C. H., Li, Y. P., Pang, H. L., Smith, N. P., Binns, L., Rigden, T., Reynolds, G., Fink, H.

SPIE - The International Society of Optical Engineering
2 国際会議録 Improved overlay measurement of CMP processed layers

Yeo,J.-H., Nam,J.-L., Oh,S.-H., Moon,J.-T., Koh,Y.-B., Smith,N.P., Smout,A.M.

SPIE-The International Society for Optical Engineering
8 国際会議録 In-chip overlay metrology of 45nm and 55nm processes

Y. S. Ku, C. H. Tung, Y. P. Li, H. L. Pang, C. M. Ke, Y. H. Wang, D. C. Huang, N. P. Smith, L. Binns

SPIE - The International Society of Optical Engineering
3 国際会議録 Overlay metrology tool calibration

L. A. Binns, P. Dasari, N. P. Smith, G. Ananew, H. Fink, C. P. Ausschnitt, J. Morningstar, C. Thomison, R. J. Yerdon

SPIE - The International Society of Optical Engineering
9 国際会議録 Improvement of alignment and overlay accuracy on amorphous carbon layers [6152-73]

Hwang, Y. S., Kang, E., Lee, K., Ban, K. D, Bok, C. K., Lim, C. M., Kim, H. S, Moon, S. C.

SPIE - The International Society of Optical Engineering
4 国際会議録 Blossom overlay metrology implementation

C. P. Ausschnitt, W. Chu, D. Kolor, J. Morillo, J. L. Morningstar, W. Muth, C. Thomison, R. J. Yerdon, L. A. Binns, P. …

SPIE - The International Society of Optical Engineering
10 国際会議録 Using in-chip overlay metrology

S. Girol-Gunia, B. Schulz, N. Smith, L. Binns

Society of Photo-optical Instrumentation Engineers
5 国際会議録 Overlay metrology at the crossroads

N. P. Smith, L. A. Binns, A. Plambeck, K. Heidrich

Society of Photo-optical Instrumentation Engineers
11 国際会議録 High-resolution optical overlay metrology

Silver, R.M., Attota, R., Stocker, M., Bishop, M., Jun, J.-S.J., Marx, E., Davidson, M.P., Larrabee, R.D.

SPIE - The International Society of Optical Engineering
6 国際会議録 In-chip overlay metrology for 45nm processes

Y. S. Ku, H. L. Pang, N. P. Smith, L. Binns

SPIE - The International Society of Optical Engineering
12 国際会議録 Influence of intermetal dielectric thickness on overlay mark size variation in photolithography

Lee,S.-J., Yoo,J.-Y., Kim,Y.-C., Kim,H., Nam,J.-L., Chung,U.-I., Kang,G.-W., Han,W.-S.

SPIE - The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12