Optimizing thermal performance-cost trade-off

Optimizing thermal performance-cost trade-off

著者名:

Dakuginow,S. ( Silicon Systems,Inc.(USA) )
Apides,R. ( Silicon Systems,Inc.(USA) )
Lacap,E. ( Silicon Systems,Inc.(USA) )
Berg,M.J. ( Seagate Technology(USA) )

掲載資料名:

Microelectronic Packaging and Laser Processing

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

3184

発行年:

1997

開始ページ:

40

終了ページ:

46

出版情報:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819426116 [0819426113]

言語:

英語

請求記号:

P63600/3184

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00016463
シリーズID:	PA00000029
会議名:	International Symposium on Microelectronics and Assembly : Microelectronic Packaging and Laser Processing
回次:	1997
会議開催地:	Singapore
会議開催年:	1997.06.25-1997.06.26

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