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Developments of optimum flip-chip bonding process

著者名:
  • Jang,D.H. ( Samsung Electronics Co.,Ltd.(Korea) )
  • Kang,S.K. ( Samsung Electronics Co.,Ltd.(Korea) )
  • Lee,Y.M. ( Samsung Electronics Co.,Ltd.(Korea) )
  • Oh,S.Y. ( Samsung Electronics Co.,Ltd.(Korea) )
掲載資料名:
Microelectronic Packaging and Laser Processing
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
3184
発行年:
1997
開始ページ:
5
終了ページ:
12
出版情報:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819426116 [0819426113]
言語:
英語
請求記号:
P63600/3184
資料種別:
国際会議録

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