Optomechanical,electrical,and thermal packaging of large 2D optoelectronic device arrays for free-space optical interconnects
- 著者名:
Ayliffe,M.H. ( McGill Univ.(Canada) ) Kabal,D. ( McGill Univ.(Canada) ) Khurana,P. ( McGill Univ.(Canada) ) lacroix,F.K. ( McGill Univ.(Canada) ) Kirk,A.G. ( McGill Univ.(Canada) ) Tooley,F.A.P. ( McGill Univ.(Canada) ) Plant,D.V. ( McGill Univ.(Canada) ) - 掲載資料名:
- Optics in Computing '98
- シリーズ名:
- Proceedings of SPIE - the International Society for Optical Engineering
- シリーズ巻号:
- 3490
- 発行年:
- 1998
- 開始ページ:
- 502
- 終了ページ:
- 505
- 出版情報:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819429490 [081942949X]
- 言語:
- 英語
- 請求記号:
- P63600/3490
- 資料種別:
- 国際会議録
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SPIE - The International Society for Optical Engineering |
SPIE - The International Society for Optical Engineering |
SPIE - The International Society for Optical Engineering |
SPIE - The International Society for Optical Engineering |
SPIE - The International Society for Optical Engineering |
SPIE - The International Society for Optical Engineering |
SPIE - The International Society for Optical Engineering |
6
国際会議録
Packaging of an optoelectronic-VLSI chip supporting a 32。゚32 array of surface-active devices
SPIE - The International Society for Optical Engineering |
SPIE - The International Society for Optical Engineering |