Aerial image measurement technique for automated reticle defect disposition (ARDD) in wafer fabs

Aerial image measurement technique for automated reticle defect disposition (ARDD) in wafer fabs

Author(s):

Zibold, A.M. ( Carl Zeiss Semiconductor Metrology Systems GmbH (Germany) )

Schmid, R.M. ( Carl Zeiss Semiconductor Metrology Systems GmbH (Germany) )

Stegemann, B. ( Carl Zeiss Semiconductor Metrology Systems GmbH (Germany) )

Scheruebl, T. ( Carl Zeiss Semiconductor Metrology Systems GmbH (Germany) )

Harnisch, W. ( Carl Zeiss Semiconductor Metrology Systems GmbH (Germany) )

Kobiyama, Y. ( Carl Zeiss Tokyo Ltd. (Japan) )

1 more

Publication title:

Photomask and Next-Generation Lithography Mask Technology XI

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5446

Pub. Year:

2004

Page(from):

728

Page(to):

736

Pages:

9

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819453693 [0819453692]

Language:

English

Call no.:

P63600/5446.2

Type:

Conference Proceedings

Details

TDL ID:	ZA00013799
Series ID:	PA00000029
Conf. info. (Name):	Photomask and Next-Generation Lithography Mask Technology
Conf. info. (Number):	2004 : 11th
Conf. info. (Venue):	Yokohama, Japan
Conf. info. (Date):	2004.04.14-2004.04.16

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