Microstructure evolution and properties of Cu-20Ni-20Mn alloy during aging process

Microstructure evolution and properties of Cu-20Ni-20Mn alloy during aging process

Author(s):

Wei-bin XIE

Publication title:

Transactions of Nonferrous Metals Society of China

Pub. Year:

2015

Vol.:

25

Issue:

10

Page(from):

3247

Page(to):

3251

Pages:

5

Pub. info.:

Changsha: Editorial Office of Trans. NFsoc., Central-South University of Technology

ISSN:

10036326

Language:

English

Type:

Academic Journal

Details

TDL ID:

ZA00066280

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