Effect of Bondline Thickness on Mode I Fracture in Adhesive Joints

Effect of Bondline Thickness on Mode I Fracture in Adhesive Joints

Author(s):

H. Qian ( Purdue University, W. Lafayette, IN )
C. Sun

Publication title:

AIAA meeting papers on disc

Title of ser.:

AIAA Paper : AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference

Ser. no.:

2008

Pub. Year:

2008

No.:

2008-1845

Paper no.:

AIAA Paper 2008-1845

Pub. info.:

Reno, Nevada: American Institute of Aeronautics and Astronautics

ISSN:

10877215

Language:

English

Call no.:

A07400/200803 [CD-ROM 2008 Disc 3]

Type:

Technical Paper

Details

TDL ID:	ZA00049521
Series ID:	PA00000154
Conf. info. (Name):	AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference
Conf. info. (Number):	49th
Conf. info. (Venue):	Schaumburg, IL
Conf. info. (Date):	2008.04.07-2008.04.10
Note for article:	49th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference, 7-10 April 2008, Schaumburg, IL

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