Effect of Curing Agent N-100 on the Thermal Decomposition Mechanism of Binder PEG

Effect of Curing Agent N-100 on the Thermal Decomposition Mechanism of Binder PEG

Author(s):

Y. Sun ( Department of Chemical Physics University of Science and Technology of Chian, Hefei, Anhui, China (prc) )

Publication title:

AIAA meeting papers on disc

Title of ser.:

AIAA Paper : AIAA/ASME/SAE/ASEE Joint Propulsion Conference and Exhibit

Ser. no.:

2007

Pub. Year:

2007

No.:

2007-5700

Paper no.:

AIAA Paper 2007-5700

Pub. info.:

Reston, Va.: American Institute of Aeronautics and Astronautics

ISSN:

10877215

Language:

English

Call no.:

A07400/200716 [CD-ROM 2007 Disc 16]

Type:

Technical Paper

Details

TDL ID:	ZA00049508
Series ID:	PA00000151
Conf. info. (Name):	AIAA/ASME/SAE/ASEE Joint Propulsion Conference and Exhibit
Conf. info. (Number):	43rd
Conf. info. (Venue):	Cincinnati, OH
Conf. info. (Date):	2007.07.08-2007.07.11
Note for article:	43rd AIAA/ASME/SAE/ASEE Joint Propulsion Conference and Exhibit, Cincinnati, OH, July 8-11, 2007

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