A New Micromechanics Model for Predicting Effective Thermal Conductivity of Heterogeneous Materials

A New Micromechanics Model for Predicting Effective Thermal Conductivity of Heterogeneous Materials

Author(s):

T. Tang ( Utah State University, Logan, UT )
W. Yu

Publication title:

AIAA meeting papers on disc

Title of ser.:

AIAA Paper : AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference

Ser. no.:

2007

Pub. Year:

2007

No.:

2007-2082

Paper no.:

AIAA Paper 2007-2082

Pub. info.:

Reston, Va.: American Institute of Aeronautics and Astronautics

ISSN:

10877215

Language:

English

Call no.:

A07400/200707 [CD-ROM 2007 Disc 7]

Type:

Technical Paper

Details

TDL ID:	ZA00049495
Series ID:	PA00000154
Conf. info. (Name):	AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference
Conf. info. (Number):	48th
Conf. info. (Venue):	Honolulu, Hawaii
Conf. info. (Date):	2007.04.23-2007.04.26

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