Effects of Thermal and Vibrational Cycles on Stresses in Lead-Free Solder Joints

Effects of Thermal and Vibrational Cycles on Stresses in Lead-Free Solder Joints

Author(s):

N. Corbitt ( Raytheon, Dallas, TX )
C. Ngo ( University of Oklahoma, Norman, OK )
F. Lai

Publication title:

AIAA meeting papers on disc

Title of ser.:

AIAA Paper : Aerospace Sciences Meeting and Exhibit

Ser. no.:

2007

Pub. Year:

2007

No.:

2007-0619

Paper no.:

AIAA Paper 2007-619

Pub. info.:

Reston, Va: American Institute of Aeronautics and Astronautics

ISSN:

10877215

Language:

English

Call no.:

A07400/200702 [CD-ROM 2007 Disc 2]

Type:

Technical Paper

Details

TDL ID:	ZA00050740
Series ID:	PA00000138
Conf. info. (Name):	AIAA Aerospace Sciences Meeting and Exhibit
Conf. info. (Number):	45th
Conf. info. (Venue):	Reno, Nevada
Conf. info. (Date):	2007.01.08-2007.01.11

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