Prediction of Delamination Resistance in Laminated Composites with Electrospun Nano-Interlayers using a Cohesive Zone Model

Prediction of Delamination Resistance in Laminated Composites with Electrospun Nano-Interlayers using a Cohesive Zone Model

Author(s):

S. Sihn ( University of Dayton Research Institute, Dayton, OH )
J. Park
R. Kim
W. Huh ( Soongsil University, Dept of Chemical & Environmental Engineering, Seoul, South Korea )
A. Roy ( U.S. Air Force Research Laboratory, Wright-Patterson AFB, OH )

Publication title:

AIAA meeting papers on disc

Title of ser.:

AIAA Paper : AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference

Ser. no.:

2006

Pub. Year:

2006

No.:

2006-1771

Paper no.:

AIAA Paper 2006-1771

Pub. info.:

[Reston, Va.]: American Institute of Aeronautics and Astronautics

ISSN:

10877215

Language:

English

Call no.:

A07400/200607 [CD-ROM 2006 Disc 7]

Type:

Technical Paper

Details

TDL ID:	ZA00047226
Series ID:	PA00000154
Conf. info. (Name):	AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference ; AIAA/ASME/AHS Adaptive Structures Conference
Conf. info. (Number):	47th ; 14th
Conf. info. (Venue):	Newport, Rhode Island
Conf. info. (Date):	2006.05.01-2006.05.04

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