Virtual Validation of Electronic System Packaging Using Reliability Criterion of an Electronic Component at Solder Joint.

Virtual Validation of Electronic System Packaging Using Reliability Criterion of an Electronic Component at Solder Joint.

Author(s):

Publication title:

2006 SAE world congress : technical paper

Title of ser.:

Society of Automotive Engineers technical paper series

Ser. no.:

2006

Pub. Year:

2006

No.:

2006-01-1613

Paper no.:

2006-01-1613

Pages:

5

Pub. info.:

Warrendale, Penn.: Society of Automotive Engineers

ISSN:

01487191

Language:

English

Call no.:

S10400

Type:

Technical Paper

Details

TDL ID:	ZA00001742
Series ID:	PA00000058
Conf. info. (Name):	SAE World Congress
Conf. info. (Number):	2006
Conf. info. (Venue):	Detroit, MI, USA
Conf. info. (Date):	2006.04.03-2006.04.06
Note for article:	2006 SAE World Congress, Detroit, MI, 3-6 April 2006; Reprinted From: Reliability and Robust Design in AUtomotive Engineering 2006, SP-2032

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