Reliability Risks with Lead-Free Soldering and Possible Solutions. | 東京工業大学附属図書館文献データベース

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Reliability Risks with Lead-Free Soldering and Possible Solutions.

Author(s):: Danielsson, H.
Publication title:: 2002 SAE world congress : technical paper
Title of ser.:: Society of Automotive Engineers technical paper series
Ser. no.:: 2002
Pub. Year:: 2002
No.:: 2002-01-1048
Paper no.:: 2002-01-1048
Pages:: 7
Pub. info.:: Warrendale, Penn.: Society of Automotive Engineers
ISSN:: 01487191
Language:: English
Call no.:: S10400
Type:: Technical Paper

Details

TDL ID:	ZA00001728
Series ID:	PA00000058
Conf. info. (Name):	SAE 2002 World Congress
Conf. info. (Number):	2002
Conf. info. (Venue):	Detroit, Michigan, USA
Conf. info. (Date):	2002.03.04-2002.03.07
Note for article:	SAE 2002 World Congress, Detroit, Michigan, 4-7 March 2002

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