Blank Cover Image

Control of Snap-through Phenomenon for thermally Deformed CFRP Laminates with Shape Memory Alloy Wires.

Author(s):
Publication title:
SME technical paper
Pub. Year:
2003
No.:
EM03-348
Paper no.:
EM03-348
Pages:
8
Pub. info.:
Society of Manufacturing Engineers
Language:
English
Type:
Technical Paper

Similar Items:

Sato, M., Sekine, H.

Society of Manufacturing Engineers

Seelecke,S.

Society of Automotive Engineers

Bisagni, C., Sala, G.

American Institute of Aeronautics and Astronautics

Dano, M.-L., Hyer, M.W.

Society of Manufacturing Engineers

Wada, M., Naoi, H., Tsukimori, K.

American Society of Mechanical Engineers

Naito,H., Matsuzaki,Y., Funami,K., Ikeda,T.

American Institute of Aeronautics and Astronautics

Horikawa, S., Fukuda, H., Iwahori, Y., Ishikawa, T.

Society of Manufacturing Engineers

Duan, B., Abdel-Motagaly, K., Guo, X., Mei, C.

American Institute of Aeronautics and Astronautics

Lin, Gang, Yang, Dong, Yu, Duli, Warrington, Robert O.

The American Society of Mechanical Engineers

Ikai, Y.

National Aeronautics and Space Administration

Elahinia, M. H., Ahmadian, M., Ashrafiuon, H., Inman, D. J.

American Society of Mechanical Engineers

Birman, Victor, Saravanos, Dimitris A., Hopkins, Dale A.

National Aeronautics and Space Adminstration

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12