Molecular Dynamics Simulation of Thermal Conductivity of Silicon Films Using Environment- Dependent Interactomic Potential.

Molecular Dynamics Simulation of Thermal Conductivity of Silicon Films Using Environment- Dependent Interactomic Potential.

Author(s):

Publication title:

A.S.M.E. paper

Title of ser.:

ASME Technical Paper : HT-FED

Ser. no.:

2004

Pub. Year:

2004

No.:

HT-FED04-56725

Paper no.:

HT-FED04-56725

Pages:

7

Pub. info.:

New York, NY: American Society of Mechanical Engineers

Language:

English

Call no.:

A11800

Type:

Technical Paper

Details

TDL ID:	ZA00001647
Series ID:	PA00000188
Conf. info. (Name):	ASME Heat Transfer/Fluids Engineering Summer Conference
Conf. info. (Number):	2004
Conf. info. (Venue):	Charlotte, North Carolina USA
Conf. info. (Date):	2004.07.11-2004.07.15
Note for article:	Heat Transfer/Fluids Engineering Summer Conference, ASME, Charlotte, NC, USA, 11-15 Jul. 2004

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