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Modeling and Analysis of Crack Growth in SnPb and SnAgCu Solder Joints in PBGA Packages: Part I- Crack Initiation.

Author(s):
Publication title:
A.S.M.E. paper
Title of ser.:
ASME Technical Paper : IMECE
Ser. no.:
2003
Pub. Year:
2003
No.:
IMECE2003-43236
Paper no.:
IMECE2003-43236
Pages:
10
Pub. info.:
New York, NY: American Society of Mechanical Engineers
Language:
English
Call no.:
A11800
Type:
Technical Paper

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