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An Evaluation of Thermal Enhancements to Flip- Chip- Plastic Ball Grid Array (FC-PBGA) Packages.

Author(s):
Publication title:
A.S.M.E. paper
Title of ser.:
ASME Technical Paper : IMECE
Ser. no.:
2003
Pub. Year:
2003
No.:
IMECE2003-42397
Paper no.:
IMECE2003-42397
Pages:
11
Pub. info.:
New York, NY: American Society of Mechanical Engineers
Language:
English
Call no.:
A11800
Type:
Technical Paper

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