Thermal Cycling Reliability of Chip Resistor Lead Free Solder Joints.
- Author(s):
- Publication title:
- A.S.M.E. paper
- Title of ser.:
- ASME Technical Paper : IMECE
- Ser. no.:
- 2003
- Pub. Year:
- 2003
- No.:
- IMECE2003-42117
- Paper no.:
- IMECE2003-42117
- Pages:
- 4
- Pub. info.:
- New York, NY: American Society of Mechanical Engineers
- Language:
- English
- Call no.:
- A11800
- Type:
- Technical Paper
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