Modeling and Analysis of Crack Growth in SnPb and SnAgCu Solder Joints in PBGA Packages: Part II- Crack Propagation.

Modeling and Analysis of Crack Growth in SnPb and SnAgCu Solder Joints in PBGA Packages: Part II- Crack Propagation.

Author(s):

Publication title:

A.S.M.E. paper

Title of ser.:

ASME Technical Paper : IMECE

Ser. no.:

2003

Pub. Year:

2003

No.:

IMECE2003-43237

Paper no.:

IMECE2003-43237

Pages:

7

Pub. info.:

New York, NY: American Society of Mechanical Engineers

Language:

English

Call no.:

A11800

Type:

Technical Paper

Details

TDL ID:	ZA00001646
Series ID:	PA00000135
Conf. info. (Name):	ASME International Mechanical Engineering Congress
Conf. info. (Number):	2003
Conf. info. (Venue):	Washington, D.C.
Conf. info. (Date):	2003.11.15-2003.11.21
Note for article:	International Mechanical Engineering Congress, ASME, Washington, DC, 15-21 Nov. 2003

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