An Investigation of Copper Dissolution and the Formation of Intermetallic Compounds in Molten Tin and Tin-Silver Solders.

An Investigation of Copper Dissolution and the Formation of Intermetallic Compounds in Molten Tin and Tin-Silver Solders.

Author(s):

Publication title:

A.S.M.E. paper

Title of ser.:

ASME Technical Paper : HT

Ser. no.:

2003

Pub. Year:

2003

No.:

HT2003-47477

Paper no.:

HT2003-47477

Pages:

6

Pub. info.:

New York, NY: American Society of Mechanical Engineers

Language:

English

Call no.:

A11800

Type:

Technical Paper

Details

TDL ID:	ZA00001645
Series ID:	PA00000189
Conf. info. (Name):	ASME Summer Heat Transfer Conference
Conf. info. (Number):	2003
Conf. info. (Venue):	Las Vegas, Nevada, USA
Conf. info. (Date):	2003.07.21-2003.07.23
Note for article:	Summer Heat Transfer Conference, ASME, Las Vegas, NV, USA, 21-23 Jul. 2003

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