Blank Cover Image

Nucleate Boiling Heat Transfer in Silicon-Based Micro-Channels.

Author(s):
Publication title:
A.S.M.E. paper
Title of ser.:
ASME Technical Paper : HT
Ser. no.:
2003
Pub. Year:
2003
No.:
HT2003-47220
Paper no.:
HT2003-47220
Pages:
4
Pub. info.:
New York, NY: American Society of Mechanical Engineers
Language:
English
Call no.:
A11800
Type:
Technical Paper

Similar Items:

Ma,K.T., Tseng,F.G., Chieng,C.C.

American Institute of Aeronautics and Astronautics

Wayner, P.C., Jr., Plawsky, J.

National Aeronautics and Space Adminstration

Chai, L.H., Peng, X.F., Ochterbeck, J.M.

American Institute of Aeronautics and Astronautics

Li,P., Chui,G.K., Glidewell,J.M., Chue,T.-H., Lai,M.-C.

Society of Automotive Engineering, Inc.

J., Yang, C., Chow. L., R., Pais M.

The American Society of Mechanical Engineers

Karayiannis, Tassos G., Al-Dadah, Raya K., James, Ron W., Allen, Peter H. G.

The American Society of Mechanical Engineers

Naterer, G.F., Chomokovski, R.S., Thiele, D., Shafai, C.

American Institute of Aeronautics and Astronautics

Dizon, M.B., Yang, J., Cheung, F.B., Rempe, J.L., Suh, K.Y.

American Society of Mechanical Engineers

Holland, A.M., Garner, C.P.

American Society of Mechanical Engineers

Han, J. C., Zhang, Y. M., Lee, C. P.

The American Society of Mechanical Engineers

Wu, H.Y., Cheng, P.

American Society of Mechanical Engineers

Bower, C., Ortega, A., Skandakumaran, P., Vaidyanathan, R., Phillips, T.

American Society of Mechanical Engineers

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12