Analysis of the Tribological Mechanisms Arising in the Chemical Mechanical Polishing of Copper-Film Wafers.

Analysis of the Tribological Mechanisms Arising in the Chemical Mechanical Polishing of Copper-Film Wafers.

Author(s):

Publication title:

A.S.M.E. paper

Title of ser.:

ASME Technical Paper : TRIB

Ser. no.:

2003

Pub. Year:

2003

No.:

2003-TRIB-241

Paper no.:

2003-TRIB-241

Pages:

19

Pub. info.:

New York, NY: American Society of Mechanical Engineers

Language:

English

Call no.:

A11800

Type:

Technical Paper

Details

TDL ID:	ZA00001644
Series ID:	PA00000191
Conf. info. (Name):	STLE/ASME Joint International Tribology Conference
Conf. info. (Number):	2003
Conf. info. (Venue):	Ponte Vedra Beach, Florida USA
Conf. info. (Date):	2003.10.26-2003.10.29
Note for article:	Joint International Tribology Conference, STLE/ASME, Ponte Vedra Beach, FL USA, 26-29 Oct. 2003

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