Design Development of High Temperature Manifold Converter Using Thin Wall Ceramic Substrate

Design Development of High Temperature Manifold Converter Using Thin Wall Ceramic Substrate

Author(s):

Umehara,K. ( NGK Insulators, Ltd. )
Yamada,T.
Hijikata,T.
Makino,M.
Katsube,F.

Publication title:

Low emission vehicle technologies

Title of ser.:

SAE special publication

Ser. no.:

SP-1260

Pub. Year:

1997

No.:

971030

Paper no.:

971030

Page(from):

123

Page(to):

130

Pages:

8

Pub. info.:

Society of Automotive Engineering, Inc.

ISBN:

9781560919728 [1560919728]

Language:

English

Call no.:

S10350/SP1260

Type:

Technical Paper

Details

TDL ID:	ZA00001035
Series ID:	PA00000003
Conf. info. (Name):	SAE International Congress & Exposition
Conf. info. (Number):	1997
Conf. info. (Venue):	Detroit, MI, USA
Conf. info. (Date):	1997.02.24-1997.02.27

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