Fractography of Adhesively Bonded SMC-Metal Joints

Fractography of Adhesively Bonded SMC-Metal Joints

Author(s):: Leung,Chuk-ling ( Rockwell International Science Center )
Publication title:: Advanced materials in future transportation design
Title of ser.:: SAE special publication
Ser. no.:: SP-754
Pub. Year:: 1988
No.:: 881186
Paper no.:: 881186
Page(from):: 25
Page(to):: 31
Pages:: 7
Pub. info.:: "Society of Automotive Engineering, Inc."
ISBN:: 9780898836813 [0898836816]
Language:: English
Call no.:: S10350/SP-754
Type:: Technical Paper

Details

TDL ID:	ZA00000555
Series ID:	PA00000003
Conf. info. (Name):	Future Transportation Technology Conference & Exposition
Conf. info. (Number):	1988
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	1988.08.08-1988.08.11

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