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Effects of ceramic ball-grid-array packages manufacturing variations on solder joint reliability

Author(s):
Publication title:
A.S.M.E. paper
Title of ser.:
ASME Technical Paper : WA/EEP
Ser. no.:
1993
Pub. Year:
1993
No.:
93-WA/EEP-2
Paper no.:
93-WA/EEP-2
Pub. info.:
New York, NY: The American Society of Mechanical Engineers
Language:
English
Call no.:
A11800
Type:
Technical Paper

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