A nonlinear multi-domain themomechanical stress analysis method for surface-mount solder joints: Part II: Viscoplastic analysis

A nonlinear multi-domain themomechanical stress analysis method for surface-mount solder joints: Part II: Viscoplastic analysis

Author(s):

Ling, S. ( University of Maryland )
Dasgupta, A.

Publication title:

A.S.M.E. paper

Title of ser.:

ASME Technical Paper : WA/EEP

Ser. no.:

1996

Pub. Year:

1996

No.:

96-WA/EEP-7

Paper no.:

96-WA/EEP-7

Pub. info.:

New York: The American Society of Mechanical Engineers

Language:

English

Call no.:

A11800

Type:

Technical Paper

Details

TDL ID:	ZA00002543
Series ID:	PA00000200
Conf. info. (Name):	ASME International Mechanical Engineering Congress & Exhibition
Conf. info. (Number):	1996
Conf. info. (Venue):	Atalanta, Ga.
Conf. info. (Date):	1996.11.17-1996.11.22
Note for article:	Presented at the 1996 ASME International Mechanical Engineering Congress & Exhibition Atalanta, Ga. - November 17-22, 1996

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