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Lead stiffness based solder joint reliability estimates for the 240-and 304-lead ceramic quad flat pack

Author(s):
Johnson, Zane ( Motorola, Inc. )  
Publication title:
A.S.M.E. paper
Title of ser.:
ASME Technical Paper : WA/EEP
Ser. no.:
1995
Pub. Year:
1995
No.:
95-WA/EEP-6
Paper no.:
95-WA/EEP-6
Pub. info.:
New York: The American Society of Mechanical Engineers
Language:
English
Call no.:
A11800
Type:
Technical Paper

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