Semi-analytic durability model for surface mount solder joints
- Author(s):
- Sundararajan, R. ( University of Maryland )
- Neel, J.
- Tiwari, N.
- Dasgupta, A.
- Barker, D.
- Publication title:
- A.S.M.E. paper
- Title of ser.:
- ASME Technical Paper : WA/EEP
- Ser. no.:
- 1997
- Pub. Year:
- 1997
- No.:
- 97-WA/EEP-12
- Paper no.:
- 97-WA/EEP-12
- Pub. info.:
- New York: The American Society of Mechanical Engineers
- Language:
- English
- Call no.:
- A11800
- Type:
- Technical Paper
Similar Items:
|
1
Technical Paper
Fatigue life of misregistered J-lead solder joints through an energy-partitioning analysis
The American Society of Mechanical Engineers |
The American Society of Mechanical Engineers |
|
The American Society of Mechanical Engineers |
8
Technical Paper
Failure concepts for surface mount electronic interconnections (E.G. solder joints)
The American Society of Mechanical Engineers |
|
3
Technical Paper
A nonlinear multi-domain themomechanical stress analysis method for surface-mount solder joints: Part II: Viscoplastic analysis
The American Society of Mechanical Engineers |
The American Society of Mechanical Engineers |
|
The American Society of Mechanical Engineers |
The American Society of Mechanical Engineers |
|
The American Society of Mechanical Engineers |
11
Technical Paper
Effect of SMC lead dimensional variabilities on lead compliance and solder joint fatigue life
The American Society of Mechanical Engineers |
|
6
Technical Paper
Relationship Between Substrate Mounting Materials and Diesel Substrate and Shell Surface Temperatures: On-Engine Experimental Testing and Thermal Modeling.
Society of Automotive Engineers |
Society of Manufacturing Engineers |