Design Development of High Temperature Manifold Converter Using Thin Wall Ceramic Substrate

Design Development of High Temperature Manifold Converter Using Thin Wall Ceramic Substrate

Author(s):

Publication title:

1997 SAE International Congress and Exposition : technical paper

Title of ser.:

Society of Automotive Engineers technical paper series

Ser. no.:

1997

Pub. Year:

1997

No.:

971030

Paper no.:

971030

Page(from):

123

Page(to):

129

Pub. info.:

Warrendale, Penn.: Society of Automotive Engineers

ISSN:

01487191

Language:

English

Call no.:

S10400

Type:

Technical Paper

Details

TDL ID:	ZA00057922
Series ID:	PA00000058
Conf. info. (Name):	SAE International Congress and Exposition
Conf. info. (Number):	1997
Conf. info. (Venue):	Detroit, Michigan, USA
Conf. info. (Date):	1997.02.24-1997.02.27
Note for article:	International Congress and Exposition, Detroit, Michigan, February 24-27, 1997

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