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High- and low-cycle fatigue characteristics of leadless chip carrier solder joints

Author(s):
Publication title:
A.S.M.E. paper
Title of ser.:
ASME Technical Paper : WA/EEP
Ser. no.:
1992
Pub. Year:
1992
No.:
92-WA/EEP-26
Paper no.:
92-WA/EEP-26
Pub. info.:
New York, NY: The American Society of Mechanical Engineers
Language:
English
Call no.:
A11800
Type:
Technical Paper

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