Computer simulation of thermo-mechanical fatigue of solder joints including microstructure coarsening
- Author(s):
- Hacke, P. ( North Carolina State University )
- Sprecher, A. F.
- Conrad, H.
- Publication title:
- A.S.M.E. paper
- Title of ser.:
- ASME Technical Paper : WA/EEP
- Ser. no.:
- 1992
- Pub. Year:
- 1992
- No.:
- 92-WA/EEP-35
- Paper no.:
- 92-WA/EEP-35
- Pub. info.:
- New York, NY: The American Society of Mechanical Engineers
- Language:
- English
- Call no.:
- A11800
- Type:
- Technical Paper
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