Blank Cover Image

Effect of SMC lead dimensional variabilities on lead compliance and solder joint fatigue life

Author(s):
Publication title:
A.S.M.E. paper
Title of ser.:
ASME Technical Paper : WA/EEP
Ser. no.:
1991
Pub. Year:
1991
No.:
91-WA-EEP-25
Paper no.:
91-WA-EEP-25
Pub. info.:
New York, NY: The American Society of Mechanical Engineers
Language:
English
Call no.:
A11800
Type:
Technical Paper

Similar Items:

Sharif, Irfan, Barker, Donald B., Dasgupta, Abhijit, Pecht, Michael G.

The American Society of Mechanical Engineers

Gupta, Vineet K., Barker, Donald B.

The American Society of Mechanical Engineers

Gupta, Vineet K., Barker, Donald B.

The American Society of Mechanical Engineers

Wong, T.E., Kachatorian, L.A., Cohen, H.M.

The American Society of Mechanical Engineers

Dasgupta, A., Verma, S., Barker, D.

The American Society of Mechanical Engineers

Sidharth, Barker, D. B.

The American Society of Mechanical Engineers

Dasgupta, A., Oyan, C., Barker, D., Pecht, M.

The American Society of Mechanical Engineers

Hu,Jun Ming, Barker,Donald B., Dasgupta,Abhijit, Arora,Ajay K.

Society of Automotive Engineering, Inc.

Dasgupta, Abhijit

National Aeronautics and Space Adminstration

Kang, H.T., Shih, H-C.

Society of Automotive Engineers

Dasgupta, Abhijit, Oyan, Chen

National Aeronautics and Space Adminstration

Wong, T. E., Cohen, H. M., Chu, D. W.

The American Society of Mechanical Engineers

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12