Fatigue properties of microelectronics solder joints

Fatigue properties of microelectronics solder joints

Author(s):

Nir, N. ( AT&T Bell Laboratories )
Dudderar, T. D.
Wong, C. C.
Storm, A. R.

Publication title:

A.S.M.E. paper

Title of ser.:

ASME Technical Paper : WA/EEP

Ser. no.:

1990

Pub. Year:

1990

No.:

90-WA/EEP-28

Paper no.:

90-WA/EEP-28

Pub. info.:

New York, NY: The American Society of Mechanical Engineers

Language:

English

Call no.:

A11800

Type:

Technical Paper

Details

TDL ID:	ZA00002460
Series ID:	PA00000200
Conf. info. (Name):	Winter Annual Meeting
Conf. info. (Number):	1990
Conf. info. (Venue):	Dallas, Texas
Conf. info. (Date):	1990.11.25-1990.11.30
Note for article:	Presented at the Winter Annual Meeting Dallas, Texas-November 25-30, 1990

Similar Items:

1 Technical Paper PBGA solder joint thermal fatigue life evaluation Wong, T. E., Cohen, H. M., Chu, D. W. The American Society of Mechanical Engineers	7 Technical Paper Thermal fatigue damage in the solder joints of leadless chip resistors Govila, R. K., Jih, E., Pao, Y.-H., Larner, C. The American Society of Mechanical Engineers
2 Technical Paper CBGA Solder Joint Thermal Fatigue Life Estimation by a Simple Method. Wong, T. E., Lau, C. Y., Fenger, H. S. American Society of Mechanical Engineers	8 Technical Paper High- and low-cycle fatigue characteristics of leadless chip carrier solder joints Fields, S., Liguore, S., Followell, D., Perez, R. The American Society of Mechanical Engineers
3 Technical Paper Gull-wing solder joint fatigue life sensitivity evaluation Wong, T.E., Kachatorian, L.A., Tierney, B.D. The American Society of Mechanical Engineers	9 Technical Paper A finite element and experimental study to creep fatigue behaviors of microelectronics solder joints Yu, Qiang, Shiratori, Masaki The American Society of Mechanical Engineers
4 Technical Paper J-lead solder joint thermal fatigue life model Wong, T.E., Kachatorian, L.A., Cohen, H.M. The American Society of Mechanical Engineers	10 Technical Paper Semi-analytic durability model for surface mount solder joints Sundararajan, R., Neel, J., Tiwari, N., Dasgupta, A., Barker, D. The American Society of Mechanical Engineers
5 Technical Paper Vibration fatigue of leadless chip carrier solder joints Liguore, S., Fields, S., Followell, D., Perez, R. The American Society of Mechanical Engineers	11 Technical Paper Bus bar solder joint durability evaluation Wong, T. Eric, Cohen, Harold M. The American Society of Mechanical Engineers
6 Technical Paper Experimentally validated thermal fatigue life prediction model for leadless chip carrier solder joint Wong, T.E., Suastegui, I., Cohen, H.M., Matsunaga, A.H. The American Society of Mechanical Engineers	12 Technical Paper Thermal Cycling Reliability of Chip Resistor Lead Free Solder Joints. Islam, N., Suhling, J. C., Lall, P., Shete, T., Gale, H. S. American Society of Mechanical Engineers

1

2

3

4

5

6

7

8

9

10

11

12