Heat transfer contributions of pins and endwall in pin-fin arrays: Effects of thermal boundary condition modeling

Heat transfer contributions of pins and endwall in pin-fin arrays: Effects of thermal boundary condition modeling

Author(s):

Chyu, M.K. ( Carnegie Mellon University )
Hsing, Y.C.
Shih, T. I.-P.
Natarajan, V.

Publication title:

A.S.M.E. paper

Title of ser.:

ASME Technical Paper : GT

Ser. no.:

1998

Pub. Year:

1998

No.:

98-GT-175

Paper no.:

98-GT-175

Pub. info.:

New York: The American Society of Mechanical Engineers

Language:

English

Call no.:

A11800

Type:

Technical Paper

Details

TDL ID:	ZA00002886
Series ID:	PA00000136
Conf. info. (Name):	International Gas Turbine & Aeroengine Congress & Exhibition
Conf. info. (Number):	1998
Conf. info. (Venue):	Stockholm, Sweden
Conf. info. (Date):	1998.06.02-1998.06.05
Note for article:	Presented at the International Gas Turbine & Aeroengine Congress & Exhibition Stockholm, Sweden - June 2-June 5, 1998 This paper has been accepted for publication in the Transactions of the ASME Discussion of it will be accepted at ASME Headquarters until September 30, 1998

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