Use of backface strain to monitor fatigue crack initiation in solder joints

Use of backface strain to monitor fatigue crack initiation in solder joints

Author(s):

Zhang, Zhehua ( University of Illinois at Urbana-Champaign )
Yao, Daping
Shang, J. K.

Publication title:

A.S.M.E. paper

Title of ser.:

ASME Technical Paper : WA/EEP

Ser. no.:

1995

Pub. Year:

1995

No.:

95-WA/EEP-11

Paper no.:

95-WA/EEP-11

Pub. info.:

New York: The American Society of Mechanical Engineers

Language:

English

Call no.:

A11800

Type:

Technical Paper

Details

TDL ID:	ZA00002553
Series ID:	PA00000200
Note for article:	Presented at the 1995 ASME International Mechanical Engineering Congress & Exposition San Francisco, California - November 12-17, 1995

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