Effect of underfill on deformations of surface laminar circuit in flip chip package
- Author(s):
- Kunthong, P. ( Clemson University )
- Han, B.
- Publication title:
- A.S.M.E. paper
- Title of ser.:
- ASME Technical Paper : IMECE/EEP
- Ser. no.:
- 1999
- Pub. Year:
- 1999
- No.:
- 99-IMECE/EEP-8
- Paper no.:
- 99-IMECE/EEP-8
- Pub. info.:
- New York: The American Society of Mechanical Engineers
- Language:
- English
- Call no.:
- A11800
- Type:
- Technical Paper
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