Thermal Joining of Highly Conductive Bonds by Using Reactive Al-Ni Nanofoils

Thermal Joining of Highly Conductive Bonds by Using Reactive Al-Ni Nanofoils

Author(s):

Publication title:

THERMEC 2016

Title of ser.:

Materials science forum

Ser. no.:

879

Pub. Year:

2017

Pt.:

3

Page(from):

1927

Page(to):

1932

Pages:

6

Pub. info.:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9783035711295 [3035711291]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00066551
Series ID:	PA00000012
Conf. info. (Name):	International Conference on Processing and Manufacturing of Advanced Materials (THERMEC' 2016)
Conf. info. (Number):	9th
Conf. info. (Venue):	Graz, Austria
Conf. info. (Date):	2016.05.29-2016.06.03
Note for article:	9th International Conference on Processing and Manufacturing of Advanced Materials (THERMEC' 2016), May 29 - June 3, 2016, Graz, Austria

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