Polyimides for Large Area Multichip Modules

Polyimides for Large Area Multichip Modules

Author(s):

Publication title:

1995 International Conference on Multichip Modules : proceedings : 19-21 April 1995, Denver, Colorado

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

2575

Pub. Year:

1995

Page(from):

501

Page(to):

506

Pages:

6

Pub. info.:

Bellingham, WA: Society of Photo-optical Instrumentation Engineers

ISSN:

0277786X

ISBN:

9780930815424 [0930815424]

Language:

English

Call no.:

P63600/2575

Type:

Conference Proceedings

Details

TDL ID:	ZA00057776
Series ID:	PA00000029
Conf. info. (Name):	International Conference on Multichip Modules
Conf. info. (Number):	1995
Conf. info. (Venue):	Denver, CO, USA
Conf. info. (Date):	1995.04.19-1995.04.21
Note for article:	1995 International Conference on Multichip Modules, April 19-21, 1995, Denver, CO, USA

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