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MCM Packaging Alternatives for Automotive Electronics Comparing Fine Pitch, Ball Grid Array, and Polyimide Chip Carriers

Author(s):
Publication title:
1995 International Conference on Multichip Modules : proceedings : 19-21 April 1995, Denver, Colorado
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
2575
Pub. Year:
1995
Page(from):
134
Page(to):
139
Pages:
6
Pub. info.:
Bellingham, WA: Society of Photo-optical Instrumentation Engineers
ISSN:
0277786X
ISBN:
9780930815424 [0930815424]
Language:
English
Call no.:
P63600/2575
Type:
Conference Proceedings

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