Test chip fabrication of 3D optically coupled common memory for parallel processing system

Test chip fabrication of 3D optically coupled common memory for parallel processing system

Author(s):

Publication title:

Optoelectronic interconnects III : 8-9 February 1995, San Jose, California

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

2400

Pub. Year:

1995

Page(from):

8

Page(to):

15

Pages:

8

Pub. info.:

Bellingham, WA: Society of Photo-optical Instrumentation Engineers

ISSN:

0277786X

ISBN:

9780819417473 [0819417475]

Language:

English

Call no.:

P63600/2400

Type:

Conference Proceedings

Details

TDL ID:	ZA00057603
Series ID:	PA00000029
Conf. info. (Name):	Symposium on optoelectronic interconnects
Conf. info. (Number):	3rd
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	1995.02.08-1995.02.09
Note for article:	3rd Symposium on optoelectronic interconnects, February 8-9, 1995, San Jose, CA, USA. 2400-02

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