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Fine Pitch Wire Bonding for µBGA Packages

Author(s):
Publication title:
27th International Symposium on Microelectronics : 15-17 November 1994, Boston, Massachusetts
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
2369
Pub. Year:
1994
Page(from):
468
Page(to):
472
Pages:
5
Pub. info.:
Bellingham, WA: Society of Photo-optical Instrumentation Engineers
ISSN:
0277786X
ISBN:
9780930815417 [0930815416]
Language:
English
Call no.:
P63600/2369
Type:
Conference Proceedings

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