Thick Film Multilayer Material Systems for Thermal Cycle Applications

Thick Film Multilayer Material Systems for Thermal Cycle Applications

Author(s):

Publication title:

27th International Symposium on Microelectronics : 15-17 November 1994, Boston, Massachusetts

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

2369

Pub. Year:

1994

Page(from):

185

Page(to):

190

Pages:

6

Pub. info.:

Bellingham, WA: Society of Photo-optical Instrumentation Engineers

ISSN:

0277786X

ISBN:

9780930815417 [0930815416]

Language:

English

Call no.:

P63600/2369

Type:

Conference Proceedings

Details

TDL ID:	ZA00057572
Series ID:	PA00000029
Conf. info. (Name):	International Symposium on Microelectronics
Conf. info. (Number):	27th
Conf. info. (Venue):	Boston, MA, USA
Conf. info. (Date):	1994.11.15-1994.11.17
Note for article:	27th International Symposium on Microelectronics, November 15-17, 1994, Boston, MA, USA

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