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New route to thermal dry-etching of copper using hydrogen peroside (H2O2) and hexafluoroacetylacetone (HFACH)

Author(s):
Publication title:
Microelectronics technology and process integration : 20-21 October 1994, Austin, Texas
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
2335
Pub. Year:
1994
Page(from):
52
Page(to):
57
Pages:
6
Pub. info.:
Bellingham, WA: Society of Photo-optical Instrumentation Engineers
ISSN:
0277786X
ISBN:
9780819416681 [0819416681]
Language:
English
Call no.:
P63600/2335
Type:
Conference Proceedings

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