Effect of heat treatments on electromigration performance for TiN/AlCu/TiN interconnect

Effect of heat treatments on electromigration performance for TiN/AlCu/TiN interconnect

Author(s):

Publication title:

Microelectronics manufacturability, yield, and reliability : 20-21 October 1994, Austin, Texas

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

2334

Pub. Year:

1994

Page(from):

14

Page(to):

22

Pages:

9

Pub. info.:

Bellingham, WA: Society of Photo-optical Instrumentation Engineers

ISSN:

0277786X

ISBN:

9780819416674 [0819416673]

Language:

English

Call no.:

P63600/2334

Type:

Conference Proceedings

Details

TDL ID:	ZA00057537
Series ID:	PA00000029
Conf. info. (Name):	Symposium on microelectronics manufacturability, yield, and reliability
Conf. info. (Number):	1994
Conf. info. (Venue):	Austin, TX, USA
Conf. info. (Date):	1994.10.20-1994.10.21
Note for article:	1994 Symposium on microelectronics manufacturability, yield, and reliability, October 20-21, 1994, Austin, TX, USA. 2334-04

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